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[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

【Available for preview】~ Substrate, Joining, Sealing, Cooling Technologies ~

Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Management －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed design guidelines for TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improvement of resin heat resistance and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Support for high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack prevention - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials

• Company：TECHNICAL INFOMATION INSTITUTE CO.,LTD
• Price：10,000 yen-100,000 yen

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